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  motorola semiconductor technical data ? motorola, inc. 2003 33290 simplified application diagram document order number: MC33290/d rev 5, 1/2003 33290 ordering information device temperature range ( t a ) package MC33290d/dr2 -40 to 125c 8-soicn iso k line serial link interface the 33290 is a serial link bus interface device designed to provide bi- directional half-duplex communication interfacing in automotive diagnostic applications. it is designed to inte rface between the vehicle?s on-board microcontroller and systems off-board t he vehicle via the s pecial iso k line. the 33290 is designed to meet the diag nostic systems iso9141 specification. the device?s k line bus driver?s output is fully protected against bus shorts and overtemperature conditions. the 33290 derives its robustness to temperature and voltage extremes by being built on a smartmos process, inco rporating cmos logic, bipolar/mos analog circuitry, and dmos power fets. although the 33290 was principally designed for automotive applications, it is suited for other serial communication applications. it is parame trically specified over an ambient temperature range of -40 c t a 125 c and 8.0 v v bb 18 v supply. the economical so-8 surface-mount plastic package makes the 33290 very cost effective. features ? designed to operate over wide s upply voltage of 8.0 to 18 v ? ambient operating temperature of -40 to 125 c ? interfaces directly to standard cmos microprocessors ? iso k line pin protected against shorts to ground ? thermal shutdown with hysteresis ? iso k line pin capable of high currents ? iso k line can be driven with up to 10 nf of parasitic capacitance ? 8.0 kv esd protection attainable with few additional components ? standby mode: no v bat current drain with v dd at 5.0 v ? low current drain during operation with v dd at 5.0 v d suffix plastic package case 751 (8-soicn) iso k line serial link interface components necessary for reverse battery (1), overvoltage transient (2), and 8.0 kv esd protection (3) in a metal module case. th is device contains 85 active transistors. v cc d x scir x d scit x d mcu v dd cen r x t x v bb iso gnd 5.0 nf(3) 27 v(3) 1.0 nf 5.0 v 10 nf(3) 500 ? (2) d(1) 45 v(2) +v bat +v dd iso k line 510 ? service scan tool or end of production line programming or system checking on-board diagnostic link 33290 t x d r x d 6 5 7 3 4 1 8 f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . .
33290 motorola analog integrated circuit device data 2 figure 1. 33290 simplified block diagram v bb cen v dd t x r x iso 40 v thermal shutdown r hys master bias 6 4 3 1 8 7 5 3.0 k ? 20 v 50 v 10 v 10 v 10 v 10 v 2.0 k ? 200 ? gnd 125 k ? 125 k ? f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . .
motorola analog integrated circuit device data 33290 3 2 3 4 8 7 6 5 1 1 2 4 3 8 7 5 6 cen v dd t x v bb nc gnd iso r x pin function description pin pin name description 1v bb battery power through external resistor and diode. 2 nc not to be connected. (note 1) 3 gnd common signal and power return. 4 iso bus connection. 5t x logic level input for data to be transmitted on the bus. 6r x logic output of data received on the bus. 7v dd logic power source input. 8 cen chip enable. logic ?1? for active state. logic ?0? for sleep state. notes 1. nc pins should not have any connections made to them. nc pins are not guaranteed to be open circuits. f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . .
33290 motorola analog integrated circuit device data 4 maximum ratings all voltages are with respect to ground unless otherwise noted. rating symbol value unit v dd dc supply voltage v dd -0.3 to 7.0 v v bb load dump peak voltage v bb(ld) 45 v iso pin load dump peak voltage (note 2) v iso 40 v iso short circuit current limit i iso(lim) 1.0 a esd voltage (note 3) human body model (note 4) machine model (note 5) v esd1 v esd2 2000 200 v iso clamp energy (note 6) e clamp 10 mj storage temperature t stg -55 to +150 c operating case temperature t c -40 to +125 c operating junction temperature t j -40 to +150 c power dissipation t a = 25 c p d 0.8 w lead soldering temperature (note 7) t solder 260 c thermal resistance junction-to-ambient r ja 150 c/w notes 2. device will survive double battery jump start conditions in ty pical applications for 10 minutes duration, but is not guarante ed to remain within specified parametric limi ts during this duration. 3. esd data available upon request. 4. esd1 testing is performed in accordance with the human body model (c zap = 100 pf, r zap = 1500 ? ). 5. esd2 testing is performed in ac cordance with the machine model (c zap = 200 pf, r zap = 0 ? ). 6. nonrepetitive clamping capability at 25 c. 7. lead soldering temperature limit is for 10 seconds maximum durati on. contact the motorola sales office for device immersion s oldering time/ temperature limits. f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . .
motorola analog integrated circuit device data 33290 5 static electrical characteristics characteristics noted under conditions of 4.75 v v dd 5.25 v, 8.0 v v bb 18 v, -40 c t c 125 c, unless otherwise noted. characteristic symbol min typ max unit power and control v dd sleep state current t x = 0.8 v dd , cen = 0.3 v dd i dd(ss) ?? 0.1 ma v dd quiescent operating current t x = 0.2 v dd , cen = 0.7 v dd i dd(q) ?? 1.0 ma v bb sleep state current v bb = 16 v, t x = 0.8 v dd , cen = 0.3 v dd i bb(ss) ?? 50 a v bb quiescent operating current t x = 0.2 v dd , cen = 0.7 v dd i bb(q) ?? 1.0 ma chip enable input high-voltage threshold (note 8) input low-voltage threshold (note 9) v ih(cen) v il(cen) 0.7 v dd ? ? ? ? 0.3 v dd v chip enable pull-down current (note 10) i pd(cen) 2.0 ? 40 a t x input low-voltage threshold r iso = 510 ? (note 11) v il(tx) ?? 0.3 x v dd v t x input high-voltage threshold r iso = 510 ? (note 12) v ih(tx) 0.7 x v dd ?? v t x pull-up current (note 13) i pu(tx) -40 ? -2.0 a r x output low-voltage threshold r iso = 510 ? , t x = 0.2 v dd , r x sinking 1.0 ma v ol(rx) ?? 0.2 v dd v r x output high-voltage threshold r iso = 510 ? , t x = 0.8 v dd , r x sourcing 250 a v oh(rx) 0.8 v dd ?? v thermal shutdown (note 14) t lim 150 170 ? c notes 8. when ibb transitions to >100 a. 9. when ibb transitions to <100 a. 10. enable pin has an internal current pull-down. pull -down current is measured with cen pin at 0.3 v dd . 11. measured by ramping t x down from 0.7 v dd and noting t x value at which iso falls below 0.2 v bb . 12. measured by ramping t x up from 0.3 v dd and noting the value at which iso rises above 0.9 v bb . 13. t x pin has internal current pull-up. pull-up current is measured with t x pin at 0.7 v dd . 14. thermal shutdown performance (t lim ) is guaranteed by design but not production tested . f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . .
33290 motorola analog integrated circuit device data 6 static electrical charac teristics (continued) characteristics noted under conditions of 4.75 v v dd 5.25 v, 8.0 v v bb 18 v, -40 c t c 125 c, unless otherwise noted. characteristic symbol min typ max unit iso i/o input low voltage threshold r iso = 0 ? , t x = 0.8 v dd (note 15) v il(iso) ? ? 0.4 x v bb v input high voltage threshold r iso = 0 ? , t x = 0.8 v dd (note 16) v ih(iso) 0.7 x v bb ?? v input hysteresis (note 17) v hys(iso) 0.05 x v bb ? 0.1 x v bb v internal pull-up current r iso = ? , t x = 0.8 v dd , v iso = 9.0 v, v bb = 18 v i pu(iso) -5.0 ? -140 a short circuit current limit (note 18) r iso = 0 ? , t x = 0.4 v dd , v iso = v bb i sc(iso) 50 ? 1000 ma output low voltage r iso = 510 ? , t x = 0.2 v dd v ol(iso) ? ? 0.1 x v bb v output high voltage r iso = ? , t x = 0.8 v dd v oh(iso) 0.95 x v bb ?? v notes 15. iso ramped from 0.8 v bb to 0.4 v bb , monitor r x , value of iso voltage at which r x transitions to 0.3 v dd . 16. iso ramped from 0.4 v bb to 0.8 v bb , monitor r x , value of iso voltage at which r x transitions to 0.7 v dd . 17. input hysteresis, v hys(iso) = v ih(iso) - v il(iso) . 18. iso has internal current limiting. f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . .
motorola analog integrated circuit device data 33290 7 dynamic electrical characteristics characteristics noted under conditions of 4.75 v v dd 5.25 v, 8.0 v v bb 18 v, -40 c t c 125 c, unless otherwise noted. characteristic symbol min typ max unit fall time (note 19) r iso = 510 ? to v bb , c iso = 10 nf to ground t fall(iso) ??2.0 s iso propagation delay (note 20) high to low: r iso = 510 ? , c iso = 500 pf (note 21) low to high: r iso = 510 ? , c iso = 500 pf (note 22) t pd(iso) ? ? ? ? 2.0 2.0 s notes 19. time required iso voltage to transition from 0.8 v bb to 0.2 v bb . 20. changes in the value of c iso affect the rise and fall time but have minimal effect on propagation delay. 21. step t x voltage from 0.2 v dd to 0.8 v dd . time measured from v ih(iso) until v iso reaches 0.3 v bb . 22. step t x voltage from 0.8 v dd to 0.2 v dd . time measured from v il(iso) until v iso reaches 0.7 v bb . f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . .
33290 motorola analog integrated circuit device data 8 electrical performance curves figure 2. iso input threshold/v bb vs. temperature figure 3. iso output/v bb vs. temperature figure 4. iso fall time vs. temperature figure 5. iso propagation delay vs. temperature -50 0 50 100 150 0.475 0.5 0.525 0.55 0.575 0.6 t a , ambient temperature ( c) v ih ; v dd = 5.25 v, v bb = 18 v v ih ; v dd = 4.75 v, v bb = 8.0 v v il ; v dd = 5.25 v, v bb = 18 v v il ; v dd = 4.75 v, v bb = 8.0 v v il and v ih , input threshold (ratio) -50 0 50 100 150 t a , ambient temperature ( c) 0.65 0.7 0.75 0.8 0.85 0.9 0.95 v dd = 5.25 v, v bb = 18 v v dd = 4.75 v, v bb = 8.0 v t fall(iso) , iso fall time ( s) v oh v ol t a , ambient temperature ( c) -50 0 50 100 150 0 0.2 0.4 0.6 0.8 1.0 1.2 v dd = 4.75 v, v bb = 8.0 v and v dd = 5.25 v, v bb = 18 v v ol and v oh , iso output (ratio) -50 0 50 100 150 t a , ambient temperature ( c) 0.2 0.3 0.4 0.5 0.6 0.7 pd h-l pd l-h v dd = 5.25 v, v bb = 18 v v dd = 4.75 v, v bb = 8.0 v v dd = 4.75 v, v bb = 8.0 v v dd = 5.25 v, v bb = 18 v t pd(iso) , propagation delay ( s) f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . .
motorola analog integrated circuit device data 33290 9 applications information introduction the 33290 is a serial link bus interface device conforming to the iso 9141 physical bus specification. the device was designed for automotive environment usage compliant with on- board diagnostic (obd) requiremen ts set forth by the california air resources board (carb) using the iso k line. the device does not incorporate an iso l lin e. it provides bi-directional half-duplex communications interfacing from a microcontroller to the communication bus. the 33290 incorporates circuitry to interface the digital translations from 5.0 v microcontroller logic levels to battery level logic and from battery level logic to 5.0 v logic levels. the 33290 is built using motorola?s smartmos process and is packaged in an 8-pin plastic soic. functional description the 33290 transforms 5.0 v microcontroller logic signals to battery level logic signals and visa versa. the maximum data rate is set by the fall time and the rise time. the fall time is set by the output driver. the rise ti me is set by the bus capacitance and the pull-up resistors on the bus. the fall time of the 33290 allows data rates up to 150 kbps using a 30 percent maximum bit time transition value. the serial link interface will remain fully functional over a battery voltag e range of 6.0 to 18 v. the device is parametrically specified over a dynamic v bb voltage range of 8.0 to 18 v. required input levels from the microcontroller are ratio- metric with the v dd voltage normally used to power the microcontroller. this enhances the 33290?s ability to remain in harmony with the r x and t x control input signals of the microcontroller. the r x and t x control inputs are compatible with standard 5.0 v cmos circuitry. for fault-tolerant purposes the t x input from the microcontroller has an internal passive pull-up to v dd , while the cen input has an internal passive pull- down to ground. a pull-up to battery is internally provided as well as an active data pull-down. the internal active pull-down is current-limit- protected against shorts to ba ttery and further protected by thermal shutdown. typical applications have reverse battery protection by the incorpor ation of an external 510 ? pull-up resistor and diode to battery. reverse battery protection of the device is provided by using a reverse battery blocking diode (?d? in the simplified application diagram on page 1). battery line transient protection of the device is provided for by using a 45 v zener and a 500 ? resistor connected to the v bb source as shown in the same diagram. device esd protection from the communication lines exiting the module is through the use of the capacitor connected to the v bb device pin and the capacitor used in conjunction with the 27 v zener connected to the iso pin. f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . .
33290 motorola analog integrated circuit device data 10 package dimensions seating plane 1 4 5 8 a 0.25 m cb ss 0.25 m b m h c x 45 l dim min max millimeters a 1.35 1.75 a1 0.10 0.25 b 0.35 0.49 c 0.19 0.25 d 4.80 5.00 e 1.27 bsc e 3.80 4.00 h 5.80 6.20 h 0 7 l 0.40 1.25 0.25 0.50 notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. dimensions are in millimeter. 3. dimension d and e do not include mold protrusion. 4. maximum mold protrusion 0.15 per side. 5. dimension b does not include dambar protrusion. allowable dambar protrusion shall be 0.127 total in excess of the b dimension at maximum material condition. d e h a b e b a1 c a 0.10 d suffix (8-lead soic) plastic package case 751-06 issue t f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . .
motorola analog integrated circuit device data 33290 11 notes f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . .
information in this document is provided solely to enable system and software implem enters to use motorola products. there are no express or implied copyright licenses granted hereunder to desig n or fabricate any integrated circuits or integrated circuits based on the informa tion in this document. motorola reserves the right to make changes without further noti ce to any products herein. motorola makes no warranty, represen tation or guarantee regarding the suitability of its products for any particular purpose, nor does motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. ?typical? parameters which may be provided in motorola data sheets and/or s pecifications can and do vary in different applications and actual performance may var y over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. motorola does not convey any license under its patent rights nor the rights of others. motorola pro ducts are not designed, intended, or authorized for use as compon ents in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in whic h the failure of the motorola product could create a situation where personal injury or death may occur. should buyer purchase or use motorola products for any such unintended or unauthorized application, buyer shall indemnify and hold motorola and its officers, employees, subsidiaries, affiliates, and di stributors harmless against all claims, costs, damages, and expenses , and reasonable attorney fees arising out of, directly or indirectly, any claim of persona l injury or death associated with such unintended or unauthorized use, even if such claim a lleges that motorola was negligent regarding the design or manufa cture of the part. motorola and the stylized m logo are registered in the us patent and trademark office. all other product or service names are t he property of their respective owners. ? motorola, inc. 2003 how to reach us: usa/europe/locations not listed: japan: motorola japan ltd.; sps, technical information center motorola literature distribution 3-20-1 minami-azabu. minato-ku, tokyo 106-8573, japan p.o. box 5405, denver, colorado 80217 81-3-3440-3569 1-800-521-6274 or 480-768-2130 asia/pacific: motorola semiconductors h. k. ltd.; silicon harbour centre 2 dai king street, tai po industrial estate, tai po, n.t., hong kong 852-26668334 home page: http://motorola.com/semiconductors MC33290/d f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . .


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